Ultrasonic Testing

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     HEMI has both contact hand scanning equipment and automated continuous scanning

(C-Scan) equipment available to evaluate bonded material.  Ultrasonic testing is not a quantitative method of bond evaluation but is a good method of identifying non-bond regions.




Contact hand scanning can evaluate specific areas for non-bond with accuracy and ease.  Hand scanning can also be used to evaluate large plates using established grids according to ASTM A-578.  The contact method uses a pulse echo transducer in contact with the clad metal surface to establish areas on a bonded plate where the sound pulse reflects at the bond interface instead of travelling into the base metal.  This indicates a lack of bond.  An example is shown below.

Figure 1.  HEMI's hand-held ultrasonic testing equipment.


Figure 2.  Hand scan of .040" AlBe alloy bonded to 3/4" aluminum


  Figure 3.  Hand scan of same plate in area of non-bond



     High Energy Metals has a C-Scan unit capable of analyzing bonded plates up to 24" x 48".  The C-Scan unit can index on the order of .010" and detect flaws as small as .040".  C-Scan evaluations are computer integrated to allow digital print-outs of any plate scan.




Figure 4.  HEMI's Automated ultrasonic C-Scan testing equipment.



Figure 5.  C-Scan standard. Defects are, from top left, 1/8", .080", .055" and .040" holes and 1 x 6, 1 x 3 and 1 x 1.5mm slots

 Figure 6.  Interface reflection amplitude color gradient key.


Figure 7.  Full image C-scan of bonded 20" x 20" Niobium to Aluminum.  Note center and edge non-bond.